What’s the difference between SMD and COB encapsulation？

1.The introduction of the LED LED display (LED display, LED screen) is composed of LED dot matrix and LED PCB panel. Through the combination of red R, green G, blue B three-color LED lights on and off to display text, pictures, animation, video, and the content , it is an active light-emitting device.It can be divided into three kinds according to the different encapsulation technology: DIP(Double in-line Package ), SMD(Surface Mounted Devices), COB(Chip On Board) 2. The Differences and advantages Between COB and SMD ①The Compression and anti-collision performance SMD (surface mounted packaging technology) products: The surface mounted LED display is to attach the SMD LED lamp to PCB with solder, which is a raised structure, and each lamp has only 4 very small welding pads, need to be moved during the production and installation. When remove the cabinet , it is easy to drop the lights or get the dead pixels due to squeezing, touching and other reasons. Prodotti di imballaggio integrati ad alta densità COB: The high-density integrated package LED display directly encapsulates the light-emitting diode chip on the PCB board, e la superficie è incapsulata con resina epossidica, che è liscio,Piatto, more impact-resistant and wear-resistant ②Protection performance SMD （surface mounted package technology) products: The lamp pin pads of the LED display are exposed, and the problem of the short circuits between the lamp pin pads are prone to occur when exposed to water or moisture; the mask used. It is uneven, and it is difficult to clean up when it is stained with dust; the alloy wires and iron brackets used are easily oxidized; Due to the exposed lamp pin pads,It is easily affected by static electricity, and there are dead lights and blind spots. COB high-density integrated package products: The high-density integrated package LED display adopts panel package technology, ...

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